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MCP9700/01
Low-Power Voltage Output Temperature Sensor
Features
* Tiny Analog Temperature Sensor * Available Packages: SC70-5 * Wide Temperature Measurement Range: - -40C to +125C * Accuracy: 4C (max.), 0C to +70C * Optimized for Analog-to-Digital Converters (ADCs): - MCP9700: 10.0 mV/C (typ.) - MCP9701: 19.5 mV/C (typ.) * Wide Operating Voltage Range: - MCP9700: VDD = 2.3V to 5.5V - MCP9701: VDD = 3.1V to 5.5V * Low Operating Current: 6 A (typ.) * Optimized to Drive Large Capacitive Loads
Description
The MCP9700/01 low-cost, low-power and tiny temperature sensor family converts temperature to an analog voltage. It provides an accuracy of 4C from 0C to +70C while consuming 6 A (typ.) of operating current. The MCP9700/01 provides a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from 25C, an accuracy of 1C (typ.) can be realized from 0C to 70C. This accuracy can also be achieved by applying system calibration at 25C. Unlike resistive sensors such as thermistors, this family does not require a signal conditioning circuit. The voltage output pin can be directly connected to an ADC input of a microcontroller. The MCP9700 and MCP9701 temperature coefficients are scaled to provide a 1 C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability.
Typical Applications
* * * * * * Hard Disk Drives and Other PC Peripherals Entertainment Systems Home Appliance Office Equipment Battery Packs and Portable Equipment General Purpose Temperature Monitoring
Package Type
SC70-5 GND 2 VOUT 3
MCP9700 MCP9701
NC 1
5 NC 4 VDD
Typical Application Circuit
VDD 10 k MCLR VSS PICmicro(R) Microcontroller VDD ANI MCP9700/01 VDD VDD VOUT GND Cbypass 0.1 F
(c) 2005 Microchip Technology Inc.
DS21942A-page 1
MCP9700/01
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD:...................................................................... 6.0V Storage temperature: ........................ -65C to +150C Ambient Temp. with Power Applied:.. -40C to +125C Junction Temperature (TJ):................................. 150C ESD Protection On All Pins: (HBM:MM):... (4 kV:200V) Latch-Up Current at Each Pin: ...................... 200 mA
Pin Function
NAME NC VOUT VDD GND Not Connected Voltage Output Power Supply Ground FUNCTION
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated: MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40C to +125C and No load. MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10C to +125C and No load. Parameter Power Supply Operating Voltage Range Operating Current Power Supply Rejection Sensor Accuracy (Notes 1, 2) TA = +25C TA = 0C to +70C TA = -40C to +125C TA = -10C to +125C Sensor Output Output Voltage: TA = 0C TA = 0C Temperature Coefficient Output Non-linearity Output Current Output Impedance Output Load Regulation Turn-on Time Typical Load Capacitance (Note 3) Thermal Response to 63% Note 1: 2: 3: 4: V0C V0C TC1 TC1 VONL IOUT ZOUT VOUT/ IOUT tON CLOAD tRES -- -- -- -- -- -- -- -- -- -- -- 500 400 10.0 19.5 0.5 -- 20 1 800 -- 1.3 -- -- -- -- -- 100 -- -- -- 1000 -- mV mV MCP9700 MCP9701 TACY TACY TACY TACY -- -4.0 -4.0 -4.0 1 -- -- -- -- +4.0 +6.0 +6.0 C C C C VDD VDD IDD PSR 2.3 3.1 -- -- -- -- 6 0.1 5.5 5.5 12 -- V V A C/V MCP9700 VDD = 2.3V - 4.0V MCP9701 VDD = 3.1V - 4.0V MCP9700 MCP9701 Sym Min Typ Max Unit Conditions
MCP9700 MCP9701
mV/C MCP9700 mV/C MCP9701 C A s pF s 30C (air) to +125C (fluid bath) (Note 4) IOUT = 100 A, f = 500 Hz TA = 0C to +70C, IOUT = 100 A TA = 0C to +70C (Note 2)
The MCP9700 accuracy is tested with VDD = 3.3V, while the MCP9701 accuracy is tested with VDD = 5.0V. The MCP9700/01 is characterized using the first-order or linear equation, as shown in Equation 3-1. The MCP9700/01 family is characterized and production-tested with a capacitive load of 1000 pF. Thermal response with 1 x 1 inch dual-sided copper clad.
DS21942A-page 2
(c) 2005 Microchip Technology Inc.
MCP9700/01
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40C to +125C and No load. MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10C to +125C and No load. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC70 Note 1: JA -- 331 -- C/W Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150C). TA TA TA TA -40 -10 -40 -65 -- -- -- -- +125 +125 +125 +150 C C C C MCP9700 (Note 1) MCP9701 (Note 1) Sym Min Typ Max Units Conditions
(c) 2005 Microchip Technology Inc.
DS21942A-page 3
MCP9700/01
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 F.
Accuracy Due to Load (C)
6.0 4.0 Accuracy (C) 2.0 0.0 -2.0 -4.0 -50 -25 0 25 50 TA (C) 75 100 125
0.2
MCP9701 VDD = 5.0V
MCP9701 VDD= 5.0V
Spec. Limits
0.1 0
MCP9700 VDD = 3.3V
-0.1
ILOAD = 100 A
MCP9700 VDD= 3.3V
-0.2 -50 -25 0 25 50 TA (C) 75 100 125
FIGURE 2-1: Temperature.
6.0 4.0 Accuracy (C) 2.0 0.0 -2.0 -4.0 -50 -25 0
Accuracy vs. Ambient
FIGURE 2-4: Changes in Accuracy vs. Ambient Temperature (Due to Load).
4.0
MCP9700 VDD = 5.5V VDD = 2.3V
MCP9701 VDD= 5.5V VDD= 3.1V
Load Regulation V/ I ( )
MCP9700/01 VDD = 3.3V
3.0
IOUT = 50 A IOUT = 100 A IOUT = 200 A
2.0
1.0
0.0
25 50 TA (C) 75 100 125
-50
-25
0
25 50 TA (C)
75
100
125
FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD.
12.0 10.0 8.0 IDD (A) 6.0 4.0 2.0 0.0 -50 -25 0 25 50 TA (C) 75 100 125
MCP9700 MCP9701
FIGURE 2-5: Load Regulation vs. Ambient Temperature.
1000
Output Impedance ( )
VDD = 5.0V IOUT = 100 A TA = 26C
100
10
1
0.1 0.1
1 1
10 100 1K 10 100 1000 Frequency (Hz)
10K 100K 10000 100000
FIGURE 2-3: Temperature.
Supply Current vs.
FIGURE 2-6: Frequency.
Output Impedance vs.
DS21942A-page 4
(c) 2005 Microchip Technology Inc.
MCP9700/01
Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 F.
35% 30% Occurrences 25% 20% 15% 10% 5% 0% 400 420 440 460 480 500 520 540 560 580 V0C (mV) 600
MCP9700 VDD = 3.3V 108 samples
35% 30% Occurrences 25% 20% 15% 10% 5% 0% 300 320 340 360 380 400 420 440 460 480 19.9 -1.6 V0C (mV) 500 -1.3 20.0
MCP9701 VDD = 5.0V 108 samples
FIGURE 2-7: (MCP9700).
45% 40% 35% Occurrences 30% 25% 20% 15% 10% 5% 0%
MCP9700 VDD = 3.3V 108 samples
Output Voltage at 0C
FIGURE 2-10: Occurrences vs. Temperature Coefficient (MCP9701).
45% 40% 35% Occurrences 30% 25% 20% 15% 10% 5% 0%
MCP9701 VDD = 5.0V 108 samples
10.0
10.1
10.2
10.3
10.4
10.5
19.0
19.1
19.2
19.3
19.4
19.5
19.6
19.7 -2.2
TC1 (mV/C)
TC1 (mV/C)
FIGURE 2-8: Occurrences vs. First-Order Temperature Coefficient (MCP9700).
40% 35% 30% Occurrences 25% 20% 15% 10% 5% 0% -2.7 -2.4 -2.1 -1.8 -1.5 -1.2 -0.9 -0.6 -0.3 0.0 TC2 (V/C )
2
FIGURE 2-11: Occurrences vs. First-Order Temperature Coefficient (MCP9701).
40%
MCP9700 VDD = 3.3V 108 samples
35% 30% Occurrences 25% 20% 15% 10% 5% 0%
MCP9701 VDD = 3.3V 108 samples
-4.3
-4.0
-3.7
-3.4
-3.1
-2.8
-2.5
TC2 (V/C )
2
FIGURE 2-9: Occurrences vs. SecondOrder Temperature Coefficient (MCP9700).
FIGURE 2-12: Occurrences vs. SecondOrder Temperature Coefficient (MCP9701).
(c) 2005 Microchip Technology Inc.
DS21942A-page 5
-1.9
0.3
19.8
9.5
9.6
9.7
9.8
9.9
MCP9700/01
Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 F.
0.30 Normalized PSR (C/V) 0.25 0.20 0.15 0.10 0.05 0.00 -50 -25 0 25 50 TA (C) 75 100 125
MCP9700 VDD= 2.3V to 4.0V
MCP9700 VDD= 2.3V to 5.5V
3.0 2.5
VOUT (V)
2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125
TA (C)
MCP9700 MCP9701
FIGURE 2-13: Power Supply Rejection (PSR) vs. Ambient Temperature.
0.30 Normalized PSR (C/V) 0.25 0.20 0.15 0.10 0.05 0.00 -50 -25 0 25 50 TA (C) 75 100 125
FIGURE 2-16: Temperature.
Output Voltage vs. Ambient
10
IDD
1.7 0.8 0.0
8 6 VOUT (V)
VOUT
MCP9701 VDD= 3.1V to 4.0V
4 2 0 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Time (ms) 1.0
-0.8 -1.7 -2.5
FIGURE 2-14: Power Supply Rejection (PSR) vs. Frequency.
1.6 1.4 1.2 VOUT (V) 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)
FIGURE 2-17:
Output vs. Time.
TA = 26C
3.0 2.5 2.0 1.5 VOUT (V) 1.0 0.5 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms)
VOUT IDD
30.0 18.0 6.0 -6.0 -18.0 -30.0 -42.0 IDD (A)
VDD_RAMP = 5V/ms TA = 26C
FIGURE 2-15: Supply.
Output Voltage vs. Power
FIGURE 2-18:
Output vs. Time
DS21942A-page 6
(c) 2005 Microchip Technology Inc.
IDD (mA)
MCP9701 VDD= 3.1V to 5.5V
12
VDD_STEP = 5V TA = 26C
2.5
MCP9700/01
Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 F.
130
105 Output (C)
80
55
SC70-5 30C (Air) to 125C (Fluid bath) 1 in. x 1 in. copper clad
30 -2 0 2 4 6 8 10 Time (s) 12 14 16 18
FIGURE 2-19:
Thermal Response.
(c) 2005 Microchip Technology Inc.
DS21942A-page 7
MCP9700/01
3.0 FUNCTIONAL DESCRIPTION
The MCP9700/01 temperature sensing element is essentially a P-N junction or a diode. The diode electrical characteristics has a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40C to 125C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/C (typ.) for the MCP9700 and 19.5 mV/C (typ.) for the MCP9701. The output voltage at 0C is also scaled to 500 mV (typ.) and 400 mV (typ.) for the MCP9700 and MCP9701, respectively. This linear scale is described in the transfer function shown in Equation 3-1.
EQUATION 3-1:
SENSOR TRANSFER FUNCTION
V OUT = T C1 * T A + V 0C Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0C = Sensor Output Voltage at 0C TC1 = Temperature Coefficient
DS21942A-page 8
(c) 2005 Microchip Technology Inc.
MCP9700/01
4.0
4.1
APPLICATIONS INFORMATION
Improving Accuracy
4.2
Shutdown Using Microcontroller I/O Pin
The MCP9700/01 accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at 25C ambient improves the measurement accuracy to a 0.5C (typ.) from 0C to 70C, as shown in Figure 4-1. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy.
The MCP9700/01 low operating current of 6 A (typ.) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/Output (I/O) pin. The I/O pin can be toggled to shutdown the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/01 as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor will be necessary.
3.0 2.0 Accuracy (C) 1.0 0.0 -1.0 -2.0 -3.0 -50 -25 0 25 50 TA (C) 75 100 125
VDD= 3.3V 10 Samples
4.3
Layout Considerations
FIGURE 4-1: vs. Temperature.
Relative Accuracy to +25C
The MCP9700/01 does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 F to 1 F be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200 resistor with a 1 F decoupling capacitor. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor.
The relative change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, specified in Equation 3-1. The accuracy can be further improved by compensating for the output non-linearity. For higher accuracy, the sensor output transfer function is also derived using a second-order equation as shown in Equation 4-1. The equation describes the output non-linearity. This equation is not used to characterize the part as specified in the DC Electrical Characteristics table; however, it provides better accuracy.
EQUATION 4-1:
SECOND-ORDER TRANSFER FUNCTION
VOUT = TC2 (TA + 10C)(125C - TA) + TC1 TA + V0C = -TC2 TA2 + (TC1 + 115 TC2)TA + 1250 TC2 + V0C Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0C = Sensor Output Voltage at 0C (refer to Figure 2-7 and 2-10) TC1 = Temperature Coefficient (refer to Figure 2-8 and 2-11) TC2 = Temperature Coefficient MCP9700 1.4 V/C2 (typ.) MCP9701 2.7 V/C2 (typ.) (refer to Figure 2-9 and 2-12)
(c) 2005 Microchip Technology Inc.
DS21942A-page 9
MCP9700/01
4.4 Thermal Considerations
The MCP9700/01 measures temperature by monitoring the voltage of a diode located in the die. A low impedance thermal path between the die and the PCB is provided by the pins. Therefore, the MCP9700/01 effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, the PCB needs to be designed with proper thermal conduction to the sensor pins. The MCP9700/01 is designed to source/sink 100 A (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2.
EQUATION 4-2:
EFFECT OF SELFHEATING
T J - T A = JA ( V DD I DD + ( V DD - V OUT ) I OUT ) Where: = Junction Temperature TJ TA = Ambient Temperature JA = Package Thermal Resistance (331C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage At TA = +25C (VOUT = 0.75V) and maximum specification of IDD = 12 A, VDD = 5.5V and IOUT = +100 A, the self-heating due to power dissipation (TJ - TA) is 0.179C.
DS21942A-page 10
(c) 2005 Microchip Technology Inc.
MCP9700/01
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SC-70 (MCP9700) Example:
XXN (Front) YWW (Back)
Device MCP9700 MCP9701
Code AUN AVN
AU2 (Front) 548 (Back)
Note: Applies to 5-Lead SC-70.
5-Lead SC-70 (MCP9701)
Example:
Device
Code AUNN AVNN
XXNN
MCP9700 MCP9701
AV25
Note: Applies to 5-Lead SC-70.
Legend: XX...X Y YY WW NNN
e3
*
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2005 Microchip Technology Inc.
DS21942A-page 11
MCP9700/01
5-Lead Plastic Small Outline Transistor (LT) (SC-70)
E E1
D p B
n
1
Q1 c A1 L Units Dimension Limits n p A A2 A1 E E1 D L Q1 c B INCHES NOM 5 .026 (BSC) MILLIMETERS* NOM 5 0.65 (BSC) 0.80 0.80 0.00 1.80 1.15 1.80 0.10 0.10 0.10 0.15 A2 A
MIN
MAX
MIN
MAX
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Top of Molded Pkg to Lead Shoulder Lead Thickness Lead Width
.031 .031 .000 .071 .045 .071 .004 .004 .004 .006
.043 .039 .004 .094 .053 .087 .012 .016 .007 .012
1.10 1.00 0.10 2.40 1.35 2.20 0.30 0.40 0.18 0.30
*Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
DS21942A-page 12
(c) 2005 Microchip Technology Inc.
MCP9700/01
APPENDIX A: REVISION HISTORY
Revision A (March 2005)
* Original Release of this Document.
(c) 2005 Microchip Technology Inc.
DS21942A-page 11
MCP9700/01
NOTES:
DS21942A-page 12
(c) 2005 Microchip Technology Inc.
MCP9700/01
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device
-
X
/XX Package
Examples:
a) MCP9700T-E/LT: Tiny Analog Temperature Sensor, Tape and Reel, -40C to +125C, 5LD SC70 package.
Temperature Range
Device:
MCP9700T: Tiny Analog Temperature Sensor, Tape and Reel, Pb free MCP9701T: Tiny Analog Temperature Sensor, Tape and Reel, Pb free = -40C to +125C
a)
MCP9701T-E/LT:
Tiny Analog Temperature Sensor, Tape and Reel, -40C to +125C, 5LD SC70 package.
Temperature Range:
E
Package:
LT =
Plastic Small Outline Transistor, 5-lead
(c) 2005 Microchip Technology Inc.
DS21942A-page 13
MCP9700/01
NOTES:
DS21942A-page 14
(c) 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
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(c) 2005 Microchip Technology Inc.
DS21942A-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
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Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205
ASIA/PACIFIC
India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459
EUROPE
Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/01/05
DS21942A-page 16
(c) 2005 Microchip Technology Inc.

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